Architecture and Process Integration Overview of 3D NAND Flash Technologies

  • Lee, Geun Ho
  • Hwang, Sungmin
  • Yu, Junsu
  • Kim, Hyungjin
Citations

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초록

In the past few decades, NAND flash memory has been one of the most successful nonvolatile storage technologies, and it is commonly used in electronic devices because of its high scalability and reliable switching properties. To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated in both industry and academia and adopted in commercial mass production. In this paper, 3D NAND flash technologies are reviewed in terms of their architecture and fabrication methods, and the advantages and disadvantages of the architectures are compared.

키워드

NAND flash memorythree-dimensional architectureprocess integrationULTRA-HIGH DENSITYMEMORYDEVICES
제목
Architecture and Process Integration Overview of 3D NAND Flash Technologies
저자
Lee, Geun HoHwang, SungminYu, JunsuKim, Hyungjin
DOI
10.3390/app11156703
발행일
2021-08
유형
Review
저널명
APPLIED SCIENCES-BASEL
11
15