Functional Chemical Materials and Treatment Methods for Advanced Packaging Technology

초록

High-performance semiconductor packages including HBM and logic are manufactured by advanced packaging (AVP) process. Herein, we introduce various functional chemical materials and chemical treatment methods applicable to AVP process. Firstly, we introduce the selective coating method for hybrid bonding application. A sequential combination of silane treatment and electroless deposition on the SiO2 dielectrics and Cu pad enables the low-temperature bonding, while securing the processing efficiency. Secondly, a new type of cleaner solution for carrier wafer de-bonding process is invented by utilizing the nonpolar swelling agent. This type of cleaner can effectively dissolve the PDMS glue without damaging the PSPI and PSR. Lastly, SiO2-em!bedded carbon nanofibers are synthesized and applied as additives for EMC. These SiO2-em!bedded carbon nanofibers are able to match the packing factors of EMC, enhancing the heat dissipation and mechanical strength. These new types of chemical materials and treatment methods may open up new possibilities for AVP process. †Corresponding Author: cmyoon4321@inha.ac.k