Study on the Curing Behavior of Eopxy Adhesive by isothermal DSC and DEA

초록

As the miniaturization and high-density packaging is the trend in the next generation mobile devices, the more fine pitch interconnection is needed. The flip chip is the most promising technology satisfying the industrial demand. There are several bonding materials used in flip chip package such as solder, ICA(Isotropic conductive adhesive), ACA(Anisotropic conductive adhesive), NCA(Nonconductive adhesive).In particular, the adhesive is applied to industrial mass production in order to snap-curing properties are required. Typically, curing behavior of the adhesive is measured using a DSC(Differential Scanning Calorimeter). But the adhesives cure within seconds of the case is difficult to measure. In this study, effective measurement methods of snap-curing behavior of electronic packaging adhesive were investigated. NCPs that used in the experiment has a cure time of 1 minute at 160℃formulated contained epoxy resin and imidazole as a hardner. In order to determine the curing behavior, isothermal DSC and DEA(Dielectric Analysis) methods were compared. Both methods retain 160 ℃and curing was determined, DoC (Degree of Cure) were compared with the measurement error. DEA method that measured the dielectric loss by changes in ion mobility does not measure more than 90% in curing behavior. But, DEA were confirmed by appropriate methods to evaluate the snap-cure properties within seconds.