A Correlation Study of Rinse Composition and Wire Bonding EFO Error in Semiconductor Packaging Process

초록

In this study, the origin of electronic flame-off (EFO) errors in the wire-bonding semiconductor packaging process is investigated, focusing on the impact of different rinse solutions used for gold (Au) wire surface treatment. Five distinct rinse solutions with 1.0 wt% containing hydrocarbon- and silicone-based surfactants are evaluated. Experimental analysis confirms that Si-containing rinses significantly increase dust adsorption on Au wire surfaces, leading to EFO errors. This is attributed to the interaction between Si components in the rinse and the electric arc during EFO, causing Si-CH3 bond cleavage and the formation of low-activation-energy nonpolar σ bonds that enhance dust adhesion. These defects compromise productivity and reliability, making the replacement of Si-containing rinses with Si-free organic solutions crucial for minimizing contamination-related issues and improving the stability of Au wire bonding. 본 연구는 2025년 정부(방위사업청)의 재원으로 국방과학연구소의 지원을 받아 수행된 미래도전국방기술 연구개발사업임(No.915066201