실리콘 마스터 제작과 UV 엠보싱공정의 효율성 개선

초록

We present the results of our improvement of silicon master fabrication and UV embossing process for low cost mass production. Deeply etched silicon master was obtained with conventional ICP reactor using 'modified Bosch process’ and this result shows high silicon etching rate and anisotropic sidewall slope. In this paper, silicon master was treated with fluorocarbon film and successfully used as a ‘anti-sticking layer’. This fluorocarbon film was characterized by deposition rate, surface roughness, and contact angle. The chemical composition was also examined with XPS analysis. In this article, low cost UV embossing system was realized and its replication characteristics was discussed.