Novel Cleaning Solution for Siloxane Residue using Nonpolar Swelling Phenomenon in Advanced Packaging Application

초록

In this study, a highly efficient etchant solution was developed for the removal of polydimethylsiloxane (PDMS) glue residues from silicon wafers during wafer-level packaging. The etchant was formulated by combining tetrabutylammonium fluoride (TBAF) with various polar and nonpolar swelling solutions by controlling the concentrations varied from 1.0?5.0 wt% and 0.0?90.0 wt%, respectively. The highest etching rate was achieved with 3.0 wt% TBAF and 70.0 wt% swelling agent, attributed to the synergy of chemical etching and swelling. Practical tests confirmed that the optimized etchant effectively removed PDMS residues from patterned wafers without damaging protective layers. This study presents an efficient and selective swelling-assisted etching method for PDMS removal, offering improved process reliability in semiconductor packaging. -본 연구는 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임(No. 2022R1A6A1A03051705). Keyword: Polydimethylsiloxane, Nonpolar Swelling agent, Tetrabutylammonium fluoride, Etchant solution, Advanced packaging process.