Comparision of the removal efficiency of the organic contaminants on silicon UV/O3 and ECR plasma O2 cleaning methods

초록

When wafers are stored in a plastic storage box in order to protect them from airborne contaminants, volatile organics from the polymeric construction material adsorbed on the wafer surface. Both the UV/O3 technique and the ECR oxygen plasma techniques have been found to completely remove these organic contaminants adsorbed on the silicon surfaces up to the detection limit. After cleaning, Si wafers were characterized using Attenuated Total Reflection-Fourier Transform Infrared Spectroscopy (ATR-FTIR) and Atomic Force Microscropy (AFM). Organic contaminants were eliminated more efficiently by the ECR oxygen plasma technique than the UV/O3 technique when they were employed under their optimum process conditions.