Al-Sb 합금의 열 크리프에 따른 미세구조 변화와 이에 따른마모 저항성 예측

초록

This study investigates the thermal creep behavior of Al–Sb alloys via in situ thin-film bulge testing at different temperatures. Al alloys are widely used across various industrial sectors because of their favorable mechanical properties. This study aims to understand the influence of solute (Sb) on the microstructure and mechanical properties, particularly creep resistance, at high temperatures. We fabricate freestanding Al–Sb thin films by physical vapor deposition and subject them to heat treatment at 150 and 250 °C for 1 h. We conduct creep tests at temperatures ranging from 75 to 150 °C. The results reveal that the addition of Sb significantly enhances the creep resistance of Al–Sb alloys. Notably, hardness increases after creep tests at 100 and 150 °C, despite the absence of significant changes in grain size or precipitation. Sb diffusion improves performance by stabilizing the microstructure and enhancing the hardness. These findings indicate that Sb plays a key role in strengthening mechanisms under thermal stress. The study also demonstrates the effectiveness of thin-film bulge testing in evaluating mechanical behavior under extreme thermal conditions. Overall, this study highlights the potential of Al–Sb alloys for advanced applications, including nuclear environments, and provides valuable insights into the behavior of nanocrystalline materials under harsh conditions.

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