Comparison of the microstructure and physical properties of electroplated and sputtered copper films

초록

Electromigration-related microstructual features of electroplated copper films were compared with those of sputtered ones bofore and after annealing. Little difference was found between the two kinds of as-deposited copper films. On the other hand, quite big difference was found in grain size, grain size uniformity, the degree of (111) preferred orientation, surface roughness and resistivity in the microstructure and physical properties between the two kinds of annealed copper films depending on the annealing temperature. The recrystallization temperature of the electroplated copper film was somewhat higher than that of the aputtered one. Dependence of the line width/grain size ratio of the two kinds of copper films on the annealing temperature are also discussed.