Fabrication of High Precision Demultiplexer using Embossing Technique with Thermal Curable Polymers

  • LEE SEUNG GOL

초록

Photonic devices have been fabricated mainly by using the conventional lithography and etch processes. However, the costs of the conventional fabrication were remained expensive, and obviously cannot meet the trend towards fiber-to-the-home (FTTH), which required lower price of the photonic components. Embossing technologies reduce the cost for the fabrication of photonic devices. In this paper, we fabricated a 1310 nm/1550 nm demultiplexer using an embossing technique with the PDMS mold.

제목
Fabrication of High Precision Demultiplexer using Embossing Technique with Thermal Curable Polymers
저자
LEE SEUNG GOL
학회명
AVS 52nd International Symposium&Exhibition