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CHARACTERISTICS OF Sn-Ag-Cu-In QUATERNARY SOLDER COMPOSITIONS AND RELIABILITY EVALUATION OF SOLDER JOINTS

  • KIM MOK SOON
제목
CHARACTERISTICS OF Sn-Ag-Cu-In QUATERNARY SOLDER COMPOSITIONS AND RELIABILITY EVALUATION OF SOLDER JOINTS
저자
KIM MOK SOON
학회명
International Conference on Soldering and Reliabilty
개최지
Hilton Toronto Airport
학회 개최일
2008-05-13 ~ 2008-05-15

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