F-RPN(Failure-RPN)을 이용한 장비 고장률 개선 연구: 반도체 식각 공정을 중심으로

A Study on Machine Failure Improvement Using F-RPN(Failure-RPN): Focusing on the Semiconductor Etching Process

초록

The purpose of this study is to present a novel indicator for analyzing machine failure based on its idle time and productivity. Existing machine repair plan was limited to machine experts from its manufacturing industries. This study evaluates the repair status of machines and extracts machines that need improvement. In this study, F-RPN was calculated using the etching process data provided by the 2018 PHM Data Challenge. Each S(S: Severity), O(O: Occurence), D(D: Detection) is divided into the idle time of the machine, the number of fault data, and the failure rate, respectively. The repair status of machine is quantified through the F-RPN calculated by multiplying S, O, and D. This study conducts a case study of machine in a semiconductor etching process. The process capability index has the disadvantage of not being able to divide the values outside the range. The performance of this index declines when the manufacturing process is under control, hereby introducing F-RPN to evaluate machine status that are difficult to distinguish by process capability index.

키워드

F-RPNRepair Status of MachineProcess Capability Index
제목
F-RPN(Failure-RPN)을 이용한 장비 고장률 개선 연구: 반도체 식각 공정을 중심으로
제목 (타언어)
A Study on Machine Failure Improvement Using F-RPN(Failure-RPN): Focusing on the Semiconductor Etching Process
저자
이형근홍용민강성우
발행일
2021-09
유형
Y
저널명
대한안전경영과학회지
23
3
페이지
27 ~ 33