Synthesis of Homogeneous Silica Nanoparticles Recycling the Semiconductor Packaging Material and Utilization as CMP Slurry

초록

Epoxy molding compound (EMC) molding waste generated from the semiconductor molding process is efficiently recycled to synthesize silica nanoparticles (SiO2) and utilized as an abrasive materials for the chemical mechanical polishing (CMP) process. The extraction of silanol precursors from EMC molding waste is achieved using NH4OH as an etchant, enabling the synthesis of homogeneous silica nanoparticles (h-SiO2) with a size of ca. 150nm via sol-gel method. The as-synthesized h-SiO2 exhibits mechanical and chemical properties comparable to those of commercial SiO2 abrasives used in CMP slurry. As a results, CMP is conducted using both the synthesized and commercial slurry to demonstrate h-SiO2 achieves a smooth surface of semiconductor wafers. Therefore, this study presents a recycling approach for converting EMC molding waste into high-purity and homogeneous SiO2. 본 연구는 2025년 정부(방위사업청)의 재원 으로 국방과학연구소의 지원을 받아 수행된 미래도전국방기술 연구개발사업임(No.915066201).