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Reliability of Flip-Chip Bonded RFID Dies by Hybrid Material;Anisotropic Condictive Adhesive

  • KIM MOK SOON
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Reliability of Flip-Chip Bonded RFID Dies by Hybrid Material;Anisotropic Condictive Adhesive
저자
KIM MOK SOON
학회명
The 1st International Symposium on Hybrid Material and Processing(HYMAP 2008)
개최지
Grand Hotel, Busan
학회 개최일
2008-10-27 ~ 2008-10-29

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