Glass bonding with a reactive bonding layer fabricated by aerosol deposition

초록

The bonding temperature was lowered by placing intermediate layers that are reactive with a glass bonding frit. A dense reactive intermediate layer, similar to 6 mu m in thickness, was anchored on STS304 by aerosol deposition (AD). The intermediate layer with PbO reacted chemically with glass frit, lowering the glass temperature. Microstructure analysis showed that the intermediate layer disappeared during the bonding process due to a reaction with the glass frit. When a TiO2/PbO mixture was deposited as an intermediate layer, TiO2 did not react with the glass frit and remained under the same heating conditions. Unreactive TiO2 contributed physically to the improvement of the bonding strength by supplying a large bonding interface area and active PbO provided a large bonding interface through a chemical reaction with the glass frit.

키워드