Syringeless Electrospun SiO2-Embedded Carbon Nanofibers as High Thermally Conductive Fillers for Epoxy Molding Compounds in Advanced Semiconductor Packaging

초록

In this study, SiO2-embedded carbon nanofibers (SiO2/CNFs) are fabricated via a syringeless electrospinning technique and applied as thermally conductive fillers in epoxy molding compounds (EMCs). Polyacrylonitrile solutions containing 20 wt% of uniformly distributed 500 nm SiO2 nanoparticles are electrospun by syringeless machine and subsequently carbonized to obtain highly loaded SiO2-embedded carbon nanofibers (h-SiO2/CNFs). And then, h-SiO2/CNFs are incorporated into EMCs for the thermal conductance test. As a result, h-SiO2/CNFs incorporated EMCs have manifested enhanced thermal conductivity compared to pristine EMC, which confirmed by the infrared thermography. Such improvement is attributed to the dual contribution of one-dimensional conduction pathways provided by the carbon network and secondary filler-to-filler bridging facilitated by embedded SiO2. - 본 연구성과물은 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임 (RS-2025-25436607). ? Keywords: Epoxy molding compound, Syringeless electrospinning, Silica-embedded carbon nanofibers, Thermal conductivity, Advanced semiconductor packaging