Development of Epoxy?Silica Bead-Type Fillers with Continuous Heat Pathways via Solvent-Exchange Method for EMC Applications

초록

In this study, epoxy-silica bead-type (ESB) fillers are synthesized via a solvent-exchange method for epoxy molding compound (EMC) application. A mixture of epoxy resin and curing agent is loaded into a syringe and dropped into an immiscible oil bath, where the droplets solidify into spherical beads. The solidified beads are subsequently coated with silica particles. The resulting ESB fillers are incorporated into EMC to obtain ESB-filled EMC (ESB-EMC). Compared with the pristine EMC containing the same amount of silica, the ESB-EMC exhibits higher thermal conductivity owing to the formation of continuous heat pathways. Moreover, infrared thermography verifies the superior heat dissipation capability of ESB-EMC. Thus, this study presents new EMC fillers for next-generation semiconductor packaging that require high-thermal conductivity. 본 연구는 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임(RS-2022-NR070869). Keywords: Epoxy bead, Silica, Thermal conductivity, Heat dissipation, Semiconductor packaging