Fabrication of SiO2 coated Silicon sludge for Epoxy molding compound filler via Recycling Silicon waste Sludge Generated from Semiconductor Manufacturing Process

초록

In this study, silicon-containing sludge waste (SS) generated from the semiconductor manufacturing process is successfully recycled as a filler for epoxy molding compounds (EMCs). The acid leaching process is first conducted to remove metal impurities originating from the metal deposition process. Subsequently, SiO2-coated SS (SiO2-SS) is prepared via a sol-gel method. The as-prepared SiO2-SS was then mixed with epoxy resin, a curing agent, and carbon black to fabricate EMCs (SiO2-SS-EMC). To evaluate the heat dissipation properties of SiO2-SS-EMC, infrared (IR) camera measurements were conducted. It was found that the surface temperature of SiO2-SS-EMC was 4.8°C higher than that of silica-based EMC, demonstrating enhanced heat dissipation. This improved heat dissipation was attributed to the superior thermal conductivity of SS, and the SiO2 layer that work as a diffusion barrier, preventing particle agglomeration and enhancing the uniformity of the material within the epoxy resin. This study presents a novel approach to recycling silicon-containing sludge waste as an EMC filler by SiO2 coating, contributing to sustainable material utilization in semiconductor waste management.