Sustainable Design of Thermally Conductive EMC Fillers Using Semiconductor Waste

초록

Sludge wastes mainly consisted of silicon (Si) generated from the semiconductor manufacturing processes are recycled as a highly thermal conductive fillers for epoxy molding compound (EMC). Initially, Si sludge underwent hydrochloric acid (HCl) treatment to remove metallic impurities, followed by hydroxylation using ammonia solution to enhance surface compatibility. Subsequently, silica is deposited onto the treated sludge via a sol-gel method, forming silica-coated semiconductor sludge (SCSS). The morphology of SCSS were successfully confirmed by various analysis. Finally, SCSS was homogeneously mixed with epoxy resin, curing agent, and carbon black, then subjected sequential processes of molding, degassing, and curing to acquire SCSS-filled EMC (SCSS-EMC). The resulting SCSS-EMC and commercial EMC-containing silica filler were compared for a thermal analysis. As a result, SCSS-EMC manifested 5?°C higher surface temperature under same heating condition. These finding successfully confirmed and suggested the recycling method of semiconductor sludge as a highly thermal conductive fillers for semiconductor packaging EMC application. - 본 연구는 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임(RS-2022-NR070869). Keyword: Semiconductor sludge waste, Epoxy molding compound, Silica, Thermal conductivity, Semiconductor manufacturing process.