Study on Residual Stress Effects of a Diaphragm for Stainless Steel MEMS Devices

초록

Residual stress effects of stainless steel have been studied as a diaphragm and a substrate material for the MEMS sensors and actuators. In the study, a fabrication process for stainless steel micro machined devices was performed on the membrane and substrate at the environment of 8.65MPa pressure and 175℃ for half an hour and then subsequently cooled down to 25℃. The finite element method is adopted to investigate the residual stresses formed in the process. Besides, out-of-plane deflections were also calculated under pressures on the diaphragm.