Prediction and Module-Level Experimental Validation of Heat-Spreading Performance in CFRP Laminate for UAV Structural Applications

초록

Structural Electronics (SE) modules in UAV structures contribute to structural simplification while needing to transfer heat generated by densely packed electronic components efficiently to the surrounding components. This study targets an SE module with a CFRP housing in which the heat path is heat source → heat dissipation panel → thermal gasket (Thermal Interface Material, TIM) → CFRP housing, and compares the expected performance of each configuration by replacing the panel and applying a thermal gasket. The panels evaluated are a baseline Al6061-T6 plate, a PAN-pitch hybrid CFRP panel structurally designed to increase both in-plane and through-thickness conductivity, and a PAN-PGS composite panel. The thermal gasket (BN-TPU and commercial EMI gaskets) is placed at the panel-housing interface to reduce contact thermal resistance and to ensure assembly repeatability.