상세 보기
Characterization of the epoxy-composite films for application to packaging of flexible electronic devices
- 제목
- Characterization of the epoxy-composite films for application to packaging of flexible electronic devices
- 저자
- PAIKKYUN SHIN
- 학회명
- Universal Academic Cluster International Spring Conference in Nagoya
- 개최지
- 나고야
- 학회 개최일
- 2016-04-03 ~ 2016-04-05