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Reliability of flip chip package using post cure type non-conductive paste

  • KIM MOK SOON
제목
Reliability of flip chip package using post cure type non-conductive paste
저자
KIM MOK SOON
학회명
International Symposium on Interfacial Joining and Surface Technology
개최지
Osaka University
학회 개최일
2013-11-27 ~ 2013-11-29

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