Visualizing distribution of thermal strain at epoxy joints through direct observation of cross-sections

초록

In this study, DIC analysis was used to evaluate the mechanical deformation of camera module joints using DGEBA epoxy and Bisphenol A/F epoxy adhesives under harsh environmental conditions such as in-situ high temperature, thermal shock, and moisture absorption, and to visualize the joint deformation distribution. Both camera modules with both adhesive materials showed stress concentrations at the bottom epoxy/housing interface, and while the modules with Bisphenol A/F epoxy achieved robust interlocking at the interface, the higher acrylic content resulted in increased epoxy shrinkage and deformation under thermal shock and moisture absorption.