Strategy for Recycling the Semiconductor Wastes as Semiconductor Epoxy Molding Compounds

초록

Semiconductor wastes (SWs), a by-product generated during the semiconductor manufacturing process, are recycled and applied as fillers for epoxy molding compounds (EMCs). In specific, metal impurities present in the SWs were removed by acid treatment, and the purified SWs were subsequently coated with silica via a sol-gel method. The resulting SSWs were applied as an EMC filler. As-synthesized SSW/EMC exhibited a surface temperature of 58.3°C, which was higher than that of EMC using conventional SiO2 fillers. This improvement in thermal dissipation is attributed to the high thermal conductivity (150 W/mK) of the silicon substrate. These results demonstrate the viability of recycling semiconductor waste into high-performance fillers, offering an efficient alternative for thermal management in semiconductor packaging applications. -본 연구는 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임(No. 2022R1A6A1A03051705). Keyword: Semiconductor waste, Sol-gel method, Recycling, Thermal conductivity, Epoxy molding compound.