마이크로-홈 구조를 통한 적층형 고출력 레이저 다이오드 바의 열응력 개선

초록

We introduce a microtrench structure to relieve the thermal stress of stacked high-power laser diode bar. As the depth of the microtrench increases, the stress decreases. However, when the micro-trench is formed beyond the depth through which the package structure penetrates, the stress rather increases.