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Reliability Adjustment of Sn-Ag-Cu-In Quaternary Lead-free Solder Joint with Increasing Cu content

  • KIM MOK SOON
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Reliability Adjustment of Sn-Ag-Cu-In Quaternary Lead-free Solder Joint with Increasing Cu content
저자
KIM MOK SOON
학회명
IUMRS-ICA2008
개최지
Nagoya Congress Center
학회 개최일
2008-12-09 ~ 2008-12-13

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