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Reliability Evaluation of BGA Solder Joints by Using Thermal Fatigue Models

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  • OUK SUB LEE
제목
Reliability Evaluation of BGA Solder Joints by Using Thermal Fatigue Models
제목 (타언어)
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저자
OUK SUB LEE
학회명
Proceedings of IMECE05, 2005 ASME International Mechanical Engineering Congress and Exposition.

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