Design and fabrication of a polymer-based micron-scale semispherical vertical interconnecting structure for 3D photonic integrated circuit application

Design and fabrication of a polymer-based micron-scale semispherical vertical interconnecting structure for 3D photonic integrated circuit application
제목
Design and fabrication of a polymer-based micron-scale semispherical vertical interconnecting structure for 3D photonic integrated circuit application
제목 (타언어)
Design and fabrication of a polymer-based micron-scale semispherical vertical interconnecting structure for 3D photonic integrated circuit application
저자
O BEOM HOAN
학회명
SPIE Int. Soc. Opt. Eng.