Electrochemical Study of the Anodic Dissolution of Copper with Electrochemical Quartz Crystal Microbalance(EQCM) in Alkaline Solution

초록

Because of its low resistivity and high electromigration resistance, copper hac been studied as a candidate for the interconnect material. Recently, it has been presented that the integration of copper interconnection, damascene and dual damascene, may resolve the pattering problem of copper layers. In damascene and dual damascene process, chemical mechanical polishing(CMP) is used to remove overburden material and planarize the surface roughness for multilevel interconnection. The CMP slurry chemistries of copper in various media have been studied by many research groups.