펄스형 Nd-YAG 레이저를 이용한 PCB(Printed Circuit Board)의 절단 파라메터

초록

We have studied PCB multilayer cutting and carbornate minimization when a PCB[μ-BGA(Ball Grid Array) is cut by the pulsed Nd-YAG(λ=532 ㎚) laser. In a PCB multilayer cutting, we used a pulsed Nd-YAG laser which has a high peak power because of the melting point of the copper layer. We can minimize the surface carbornation and cutting line width. In Nd-YAG laser cutting the nitrogen gas primarily removes a vaporized material from the cut zone and reduces s surface carbornation with a sacrifice layer. The SEM(scanning electron microscope) and high magnification microscope are used to measer s cutting line-width and surface damage.