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Formulation and Evaluation of Anisotropic Conductive Paste for High Speed Chip Bonding in RFID Inlay Assembly

  • KIM MOK SOON
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Formulation and Evaluation of Anisotropic Conductive Paste for High Speed Chip Bonding in RFID Inlay Assembly
저자
KIM MOK SOON
학회명
1st International Conference on R2R Printed Electronics 2008
개최지
단국대학교
학회 개최일
2008-04-30 ~ 2008-05-02

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