Evaluation of Drop Impact Reliability of Sn-Ag-Cu-In Solder Joint with Various Test Method

초록

In a previous study, the authors suggested that a quaternary alloy with the composition, Sn- 1.2(Wt.%)Ag-0.7Cu-0.4In, is a promising candidate for replacing representative Pb-free solder composition, Sn-3.0Ag-0.5Cu. The Sn-1.2Ag-0.7Cu-0.4In solder composition showed significantly improved drop test performance over not only Sn-3.0Ag-0.5Cu solder composition, but also Sn- 1.0Ag-0.5Cu solder composition. Also, Sn-1.2Ag-0.7Cu-0.4In solder alloy doped with Mn or Pd showed surprisingly improved drop test performance. In this study, the drop impact reliabilities of Sn- 1.2Ag-0.7Cu-0.4In solder alloy and Sn-1.2Ag-0.7Cu-0.4In solder alloy doped with Mn or Pd solder alloy were evaluated by the various drop test method using a self-made drop impact tester. And failure mechanism with each drop test method was investigated.