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Thick Origami–Based Design of a Compactly Stowable Deployable Wing
- Kim, Byoung-Gyu;
- Miyazawa, Yasuhiro;
- Yang, Jinkyu;
- Lee, Hak-Tae
SCOPUS
0초록
Aerial Mars exploration vehicles offer distinct advantages in terms of exploration range and terrain accessibility, but the low density of the Martian atmosphere necessitates large wings to generate sufficient lift for flight. However, due to the limited payload volume of the launch vehicle, a packaging challenge associated with large wings arises, which considerably restricts both the capability and the operational scope of the exploration vehicle. Deployable wing designs can address this packaging problem, yet existing designs have difficulty in simultaneously achieving both load-bearing capability and compact stowage. To address this challenge, we propose a deployable wing design composed of multiple flat-foldable thick origami modules, which significantly reduces the wing’s stowed volume and projected area compared to the deployed configuration, while supporting structural loads through rigid panels. The structure also takes advantage of the thick origami geometry, which can restrict folding angles and thereby provide a readily lockable deployed configuration. Shape optimization was performed to match the target airfoil geometry, demonstrating that a relatively small number of thick origami modules is sufficient for accurate shape approximation. This approach can be widely applicable to a variety of airfoil configurations, including subsonic and supersonic designs. It could also enable the transportation of large, high-performance wings within limited volumes, significantly contributing to planetary exploration missions and portable aerial vehicles. © 2025, American Institute of Aeronautics and Astronautics Inc, AIAA. All rights reserved.
- 제목
- Thick Origami–Based Design of a Compactly Stowable Deployable Wing
- 저자
- Kim, Byoung-Gyu; Miyazawa, Yasuhiro; Yang, Jinkyu; Lee, Hak-Tae
- 발행일
- 2026
- 유형
- Conference paper
- 저널명
- AIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2026