MEMS 적용을 위한 Ni-Mn의 증착과 물성

초록

In recent years, much attention has been paid to MEMS(Micro Electro Mechanical Systems) and deposition of metal inside vias or trenches becomes the impoetant fabrication processes for making the mechanical elements of MEMS device. Electrodeposition has several advantaqges over alternative techniques, such as the high deposition rate, the easy control for thickness and low cost. Ni-Mn alloy has a higher stress level and can be applied to the structural materials for MEMS. However, a low reduction potential of Mn+2 prohibits the electrodeposition of Mn+2 resulting in the alloy deposition. In this work, we investigated the effect of current pulse waveform and current pulse waveform and current density on Ni-Mn alloy electrodeposition for MEMS applications. Ni-Mn electrodeposition are storngly influenced by the current density and the pulse current conditions. Mn content was affected by applied current density, pulse time, and duty ratios. Current densities were controlled by an EG&G PAR273A potentiostat & glavanostat and various pulse times and duty cycles were superimposed with the function generator. Energy dispersive X-ray spectroscopy(EDS) was used to analyze elemental compositions of the Ni-W alloys. Structural analysis of the deposits was performed by means of X-ray diffraction(XRD).