상세 보기
Improvement of heat conduction of die attach layer for high power LED package
- 제목
- Improvement of heat conduction of die attach layer for high power LED package
- 저자
- O BEOM HOAN
- 학회명
- The 2nd International Conference on Advanced Electromaterials
- 개최지
- ICC Jeju
- 학회 개최일
- 2013-11-12 ~ 2013-11-15