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Effect of Cu content on the reliability of Sn-Ag-Cu-In Quaternary Solder Alloy

  • KIM MOK SOON
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Effect of Cu content on the reliability of Sn-Ag-Cu-In Quaternary Solder Alloy
저자
KIM MOK SOON
학회명
International Conference in Electronics Packaging 2009(ICEP 2009)
개최지
Kyoto International Conference Center
학회 개최일
2009-04-14 ~ 2009-04-16

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