Molecular-Interface-Engineered Wire Bonding for Semiconductor Packaging Process

초록

This study investigates molecular-interface-engineered wire bonding as a strategy to identify and mitigate electronic flame-off (EFO) errors in semiconductor packaging. Au wires were treated with 1.0 wt% rinse solutions containing hydrocarbon- or silicone-based surfactants, followed by bonding experiments under Si-dust conditions. OM and FE-SEM revealed that silicone-based rinses promoted severe dust adsorption through thermal cleavage of Si?CH3 bonds during the EFO arc, producing nonpolar σ bonds that readily interacted with particulates. This interfacial contamination destabilized ball formation and increased EFO error. In contrast, silicone-free rinses effectively suppressed dust-induced defects and stabilized ball formation, demonstrating that molecular-interface-engineered wire bonding offers a robust pathway to enhance the reliability of semiconductor packaging. - 본 연구는 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임(RS-2022-NR070869).? Keywords: Au wire bonding, Electronic flame-off, Rinse chemistry, Si-dust contamination, Semiconductor packaging