Synthesis of a Highly-Effective One-Dimensional Thermal Additive for Epoxy Molding Compound

초록

In this study, SiO2-embedded carbon nanofibers (SiO2@CNFs) are fabricated to enhance the thermal conductivity and mechanical strength of epoxy molding compound (EMC) for semiconductor. SiO2 with sizes of 100, 300, and 500 nm are prepared via the Stober method and incorporated into CNFs through electrospinning and carbonization. The resulting SiO2@CNFs are mixed with EMC at 0.1-1.0 wt% to evaluate thermal conductivity improvements. EMC with 0.4 wt% of 500-SiO2@CNFs exhibit a 69% increase in thermal conductivity and 40% higher impact strength than pristine EMC. These enhancements are attributed to the 1D CNF structure and the optimized SiO2 size, improving heat dissipation. IR camera analysis confirms faster heat dissipation in SiO2@CNFs-EMC. This study presents an approach to enhancing EMC performance for semiconductor. 본 연구는 2025년 정부(방위사업청)의 재원으로 국방과학연구소의 지원을 받아 수행된 미래도전국방기술 연구개발사업임(No.915066201).