Recycling and Upcycling of Silica in Semiconductor Process

초록

In this study, epoxy molding compound wastes generated from the semiconductor molding process are recycled and silica materials are obtained, resulting recycled materials were upcycled as slurry for polishing application. Specifically, silica-precursor was extracted from epoxy molding compound waste by base treatment. With the sol-gel method, recycled silica-precursor was synthesized as uniform silica nanoparticles. For the upcycling, silica nanoparticles were formulated as slurry for polishing process. For the practical application, recycled silica-employed polishing slurry showed sufficient polishing performance for silicon chip. Accordingly, this work shows a typical recycling and upcycling of silica in semiconductor process. - 본 연구성과물은 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임 (RS-2025-25437265).? Keywords: Silica, Recycling, Upcycling, Semiconductor, Slurry