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초록
We present a Chip on Board(COB) structure based on an Metal Core Printed Circuit Board(MCPCB) without dielectric layer. Because there is no an dielectric layer between the LED chip and the substrate, the heat from the chip is easily dissipated through the substrate. As a result, thermal resistance is lower than the conventional COB.
- 제목
- LED COB 패키지의 방열 성능 개선
- 제목 (타언어)
- Chip On Board Packing of Light Emitting Diodes with low thermal resistance
- 저자
- LEE SEUNG GOL
- 학회명
- 2011년 Photonics Conference
- 개최지
- 강원도 평창 휘닉스파크
- 학회 개최일
- 2011-11-30 ~ 2011-12-02