Synthesis of Abrasive Materials for CMP Slurry Using Recycled Semiconductor Molding Waste

초록

In this study, silica nanoparticles (SiO2 NPs) are synthesized by recycling epoxy molding compound (EMC) waste generated from the semiconductor packaging process and applied as abrasive material of the CMP slurry. Specifically, silanol precursors are extracted from EMC using NH4OH etchant solution and continually used for synthesizing the SiO2 NPs with 100 nm. The impurity and the morphology of the as-synthesized SiO2 NPs are examined, and compared with commercial SiO2. For practical CMP applications, CMP slurry is prepared using as-synthesized SiO2 as an abrasive material and polished the semiconductor chip. As a result, the surface of the chip is successfully turned into a smooth surface. Hence, this study presents a novel method for recycling EMC waste into high-quality SiO2 nanoparticles and applying in semiconductor processes. - 본 연구는 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임(RS-2022-NR070869). Keywords: EMC waste, SiO2 nanoparticle, CMP slurry, Semiconductor molding process, Silanol precursor