Numerical stress analysis on thermal nano-imprint lithography

초록

In this paper, we investigate the stress distribution of polymer film in thermal nano-imprint lithography (NIL). In order to simulate this process, commercially available software was employed for NIL process simulation. The proposed model is imprinting a rigid SiO2 stamp with a rectangular line pattern into a viscoelastic Polymethyl methacrylene (PMMA) film. The distribution of stress in the polymer film is calculated for the detail analysis of deformation behavior. These calculated results represent asymmetric von Mises stress distribution of the polymer around the external line caused by the squeezing flow under flat space.