Development of Functional Chemical and Polymer Materials for Advanced Packaging Technology

초록

High-performance semiconductor packages, such as HBM, are manufactured by advanced packaging (AVP). Herein, we introduce the development of various functional polymer and chemical materials applicable to AVP. First, we present a new type of cleaner solution utilizing the nonpolar swelling agent for the carrier wafer de-bonding process. This cleaner can effectively dissolve the silicone polymers without damaging the dielectric layer. Second, we have developed a novel additive for EMC by synthesizing SiO2-embedded carbon nanofibers that match the packing factors of EMC, thereby enhancing heat transfer. Lastly, we have invented a selective coating method applicable to future hybrid bonding processes. A sequential combination of silane treatment and electroless deposition on the dielectric and Cu pad enables low-temperature chip-to-chip bonding while ensuring processing efficiency. These innovative materials and processing methods may unlock new possibilities for AVP technology.