Comparative Investigation of EFO Errors in Semiconductor Wire Bonding Identification of Fundamental Causes through Surface Treatment and Electrical Discharge Analysis

초록

This study examines the root cause of electronic flame-off (EFO) errors in wire-bonding semiconductor packaging, with a particular focus on the impact of rinse solutions used for gold (Au) wire surface treatment. Five distinct rinse solutions containing hydrocarbon- and silicone-based surfactants were evaluated. Optical microscopy (OM) and field-emission scanning electron microscopy (FE-SEM) analyses revealed that Si-containing rinse solutions significantly increase dust adhesion on the Au wire surface, leading to EFO errors. This effect is attributed to the interaction between Si components in the rinse and the electric arc during EFO, where Si?CH3 bond cleavage generates low-activation-energy nonpolar σ bonds that promote dust adhesion, compromising process reliability and productivity. Therefore, to mitigate contamination and enhance process stability, replacing Si-containing rinses with Si-free organic solutions is recommended, effectively reducing contamination-related defects and improving the stability and reliability of the Au wire-bonding semiconductor packaging process. Keywords : Au wire, Electronic flame-off, Si-containing rinse solutions, Wire-bonding semiconductor packaging, Dust adhesion †Corresponding Author: cmyoon4321@inha.ac.kr