CFD를 이용한 대면적 웨이퍼의 PR 식각 공정 분석

초록

In this paper, a chamber has been developed to strip photoresists on large-area wafers. It is calculated by different RF-power and inlet flow rate of oxygen. And distribution of each species and velocity magnitude, which is 1mm above wafer surface, are investigated. The software that used is CFD-ACE+. The ashing rate is improved as RF-power and flow rate are increased. However the uniformity is decreased when those are increased.