Formation and Sealing of Nano Porous Aluminum Oxide Layer on Aluminum Metal Substrate for High Power Device Application

초록

High thermal-dissipating material and structure have been required to packaging substrate for high power devices, such as LED modules, power supplies, regulators and controllers in the field of lighting, electric vehicle, solar energy system and so on. Recently, a MCCL (Metal Base Copper Clad Laminate), composed of aluminum base layer, polymer insulation layer and copper metallization layer, is known to be effective thermal-dissipating substrate, although thermal management is limited by the existence of the polymer insulation layer. In this work, new type of aluminum base thermal-dissipating substrate insulated with nano porous aluminum oxide layer was fabricated and its thermal property was evaluated. The nano porous aluminum oxide was formed by an anodizing method, and a series of nano porous structure was achieved by controlling electrolyte temperature and anodizing time. If necessary, the nano pores were sealed with using various kinds of sealant. Copper metallization layer was successfully developed on the aluminum oxide insulation layer. Thermal test results revealed that newly developed MCCL containing aluminum oxide insulation layer exhibits better thermal performances than commercial MCCL containing polymer insulation layer.