위성 카메라용 고 신뢰성 특수 인쇄회로 기판의 열-구조 특성 전산모사

초록

We simulate thermal-structure property of a high reliability special printed circuit board for a satellite camera. Because conventional FR4 PCB have thermal problem in extreme temperature environment, we estimate a high heat-resistant polyimide based PCB about thermal deformation and stress. As a result, thermal deformation of polyimide based PCB is about 30% of it of FR4 PCB and thermal stress of polyimide based PCB is about 80% of it of FR4 PCB. a polyimide based high reliability special printed circuit board for a satellite camera is also estimated that it is possible to use it in extreme temperature environment.