Comparison of the properties of the CVD Cu film with those of the electroless-plated Cu film

초록

The CVD Cu film was found to be superior to the electroless-plated film from the viewpoint of surface morphology, thickness uniformity, resistivity and selectivity. The best surface morphology and thickness uniformity were obtained at the deposition temperatures of 180℃ in CVD and 60oC, in electroless plating, respectively. The electrical resistivity of the electroless-plated Cu film showed much stronger dependence on the deposition temperature than the CVD-Cu film. The CVD Cu film deposited at 220℃ showed the lowest resistivity and the highest degree of (111) preferred orientation. while the electroless-plated Cu film is deposited at 60 oC did.