Effect of Wire Surface Treatment and Condition on Wire Bonding Reliability in Semiconductor Packaging

초록

A comparative study of organic and inorganic rinses was conducted to investigate the reliability of Au wire bonding with respect to electronic flame-off (EFO) errors. Au wires were treated with various rinses, and EFO was performed in a Si-dust?containing environment. Interestingly, wires treated with inorganic rinses containing silicon (Si) compositions exhibited significant dust adsorption due to polar?polar interactions. In contrast, wires treated with organic rinses showed clean surfaces, indicating that Si-containing rinses or contamination can increase the probability of EFO errors. These findings demonstrate that appropriate surface treatment and condition like optimizing the rinse chemistry are critical to improving the reliability of Au wire bonding in semiconductor packaging. - 본 연구는 2025년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임(RS-2022-NR070869). Keywords: Surface treatment, Wire bonding, Rinse, Reliability, Semiconductor packaging